IEC IEC60191-6-22 Edition 1.02012-12 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanicalstandardizationofsemiconductordevices Part6-22:General rulesforthepreparationofoutlinedrawingsofsurface mountedsemiconductordevicepackages-Designguideforsemiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) Normalisationmecaniquedesdispositifsasemiconducteurs Partie6-22:Reglesgeneralespourlapreparationdesdessinsd'encombrement desdispositifsasemiconducteursamontageensurface-Guidedeconception pourlesboitiersmatricielsabillesetapasfinsensiliciumetboitiersmatriciels a zone de contact plateetapas fins en silicium (S-FBGAet S-FLGA) IEC 60191-6-22:2012 Copyrighted material i licensed to BRDemoby THISPUBLICATIONISCOPYRIGHTPROTECTED Copyright2012IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified, no part of thispublication may be reproduced orutilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester. please contact the address below or your local IEC member National Committee for further information. Thomson utilisee sous quelque forme que ce soit et par aucun procede, électronique ou mecanique, y compris la photocopie et les microfilms, sans I'accord ecrit de la CEl ou du Comite national de la CEl du pays du demandeur. Reuters Si vous avez des questions sur le copyright de la CEl ou si vous desirez obtenir des droits supplementaires sur cette publication, utilisez les coordonnees ci-apres ou contactez le Comite national de la CEl de votre pays de residence. (Scientific), Inc., IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varembe Fax: +4122919 03 00 CH-1211 Geneva 20 info@iec.ch Switzerland www.iec.ch About the IEC , subscriptions.techstreet.com,downloaded The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. AboutIECpublications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Useful links: IEC publications search - www.iec.ch/searchpub Electropedia -www.electropedia.org The advanced search enables you to find IEC publications The world's leading online dictionary of electronic and by a variety of criteria (reference number, text, technical electrical terms containing morethan 30 000 terms and committee....). definitions in English and French, with equivalent terms in It also gives infomation on projects, replaced and additional languages:Also known as the International withdrawn publications. Electrotechnical Vocabulary (IEV) on-line. d on Nov-27-2014 by IEC Just Published - webstore.iec.ch/justpublished CustomerServiceCentre-webstore.iec.ch/csc Stay up to date on all new IEC publications. Just Published If you wish to give us your feedback on this publication details all new publications released. Available on-line and or need furtherassistance.please contactthe also once a month by email. Customer Service Centre: csc@iec.ch. y James Madison. No further AproposdelaCEl La Commission Electrotechnique Internationale (CEl) est la premiere organisation mondiale qui elabore et publie des Normes internationales pour tout ce qui a trait a I'électricite,a i'électronique et aux technologies apparentees. AproposdespublicationsCEl Le contenu technique des publications de la CEl est constamment revu. Veuillez vous assurer que vous possedez I'edition la plus recente, un corrigendum ou amendement peut avoir ete publie. Liens utiles: reproduction Recherchedepublications CEl-www.iec.ch/searchpub Electropedia-www.electropedia.org La recherche avancee vous permet de trouver des Le premier dictionnaire en ligne au monde de termes publications
IEC 60191-6-22 2012 Mechanical standardization of semiconductor devices - Part 6-22 General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guid
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